[Betsy, Koji] @Bonding lab
The OMC is sit in the bonding lab for curing of the epoxy. Otherwise, it is ready to be moved to the chamber side.
- 3rd OMC optics cleaning
Attachment 1:
We applied FirstContact cleaning of the optical surfaces. The optical side of the breadboard was wiped with IPA-soaked cloth (without touchting the optics).
The FCs will be left until the OMC is brought to the chamber side.
- PD replacement
Attachment 2:
The original OMC DCPDs were replaced with the new high QE DCPDs. The PDs at the BS transmission and reflection sides are from the PD cage A slot 3 (A3) and A4, respectively. They correspodns to the PD serials B1-01 and B1-16. The final testing at Caltech showed the QEs of 0.980 and 0.981 respectively.
The FirstContact seals are attached on the PD apertures to prevent particulates come into the PD surfaces.
- Mounting blacket bonding reinforcement
Attachment 3:
We added a glass prism to reinforce the bonding of one of the mounting blackets on the top (suspension) side of the OMC breadboard. A small amount of glue residue form the existing bond was removed by a razor blade to clean the place for the new prism. As small amount of glue as possible was applied to have round glue foot print, particularly on the glass-glass joint. The glue on the Invar-glass joint looks round. The glue on the glass-glass joint looks square inspite of our effort (We really don't think it is an issue). A steel block was added to hold the prism until the epoxy is cured.
The test data for B1-01 (DCPDA, that in transmission of the OMC TRANS BS) and B1-16 (DCPDB, that in reflection of the OMC TRANS BS) can be found here in the 40m eLOG 255: https://nodus.ligo.caltech.edu:8081/OMC_Lab/255 The serial numbers are indicated in the OMC DCPD wiring chain, D1300502