Reports until 13:30, Monday 13 January 2014
H1 SUS (SUS)
betsy.weaver@LIGO.ORG - posted 13:30, Monday 13 January 2014 (9238)
ITM03 Test Mass processing incident

On Friday, Gerardo and I encountered an issue while processing the optic as per the ear bonding procedure.  During the processing, the optic suffered a 3mmx 3mm crack at the bevel on the HR side of the optic and some scratches out near the edge of the HR face.  We're working to understand whether or not it can be used in BSC3, but our expectation is that it can, owing to the small nature of the crack.  We are also working with COC/SUS/SYS so this damage does not occur during future processing.